The technical indicators of electronic grade nitrogen trifluoride (NF₃) need to be strictly classified according to application scenarios (such as semiconductor etching, cleaning, photovoltaics, etc.). The core indicators are as follows:

1. Basic purity level

Note: About 92.8% of the electronic grade NF₃ in the world are concentrated in the 5N level, and the 6N level has a market share of less than 8% due to process difficulty.

2. Key impurity limit (taking level 5N as an example)

Special control items:

Phosphine (PH₃) and hydrogen arsenide (AsH₃) need ≤0.05 ppb (grade 6N)

Greenhouse gas potential (GWP) ≤17,000 (refer to IPCC standard)

3. Packaging and storage and transportation standards

Container requirements

Nickel-based alloy/chromium-molybdenum alloy cylinder, electrolytic polishing and passivation treatment of inner wall.

The valve is made of copper alloy and is equipped with a double blocking and leakage prevention device.

Filling standards

Filling pressure ≤1.5 MPa, three-stage pressure stable filling method is adopted

Filling coefficient ≤0.76 kg/L (trifluoromethane analogy requirements)

Storage and transportation conditions

Store in an environment with a humidity of 45–65% from light.

Pressure fluctuations need to be monitored during the transportation process (bumping frequency ≤2.5 times/second).

Leak alarm threshold is 0.5%, explosion limit is 2.3–82%.

4. Testing methods and standard basis

Implementation standards:

Purity and safety: GB/T 21287-2021 (replace 2007 version)

Transportation safety: TSG R0006 "Technical Supervision Regulations for Gas Bottle Safety"

5. Application risk correlation

Semiconductor etching:

HF >0.1 ppm will corrode the vacuum system, and O₂ >1 ppm will cause wafer threshold voltage drift.

Cavity cleaning:

Moisture >0.5 ppm reduces the cold wall cleaning efficiency, and metal residue >1 ppb causes device failure.

Photovoltaic manufacturing:

Particulate matter exceeds the standard and causes microcracks on the surface of solar cells, and the photoelectric conversion rate decreases by ≥15%.

A wafer factory suffered a scrapped entire batch of chips due to an oxygen content exceeding the standard (5 ppm), with losses of more than 10 million US dollars.